Editorial Board
Senior Editors
Dr. Mihail Belkin, Technical University of Munich, Germany
Prof. Hoon Kim, Korea Advanced Institute of Science and Technology, Korea
Dr. Wibool Piyawattanametha, King Mongkut's Institute of Technology, Thailand
Dr. Andrew W. Poon, The Hong Kong University of Science and Technology, Hong Kong
Dr. Jonahan Wierer, North Carolina State University, USA
Associate Editors
Prof. Jose Azana, Institut National de la Recherche Scientifique, Canada
Dr. Jian Chen, Nanjing University of Posts and Telecommunications, China
Dr. Hao Chi, Hangzhou Dianzi University, China
Prof. Daoxin Dai, Zhejiang University, China
Dr. Angela Dudley, University of Witwatersrand, South Africa
Dr. Ivana Gasulla, Universidad Politecnica de Valencia, Spain
Dr. Amirhossein Ghazisaeidi, Nokia Bell Labs, France
Dr. Mariangela Gioannini, Politenico di Torino, Italy
Prof. Miguel González-Herráez, University of Alcalá, Spain
Dr. Lingling Huang, Beijing Institute of Technology, China
Dr. Ezra Ip, NEC Labs America, USA
Prof. Deep Jariwala, University of Pennsylvania, USA
Dr. Diaa Khalil, Ain Shams University, Egypt
Dr. Kwanil Lee, Korea Institute of Science and Technology, Korea
Dr. Ruben Luis, National Institute of Information and Communication Technology, Japan
Dr. Xianshu Luo, Advanced Micro Foundry Pte. Ltd, Singapore
Dr. Jason D. McKinney, Purdue University, USA
Dr. Sha Shiong Ng, University Science Malaysia, Malaysia
Dr. Pierluigi Poggiolini, Politecnico di Torino, Italy
Prof. San-Wan Ryu, Chonnam National University, Korea
Dr. Haiding Sun, Nanyang Technology Univeristy, Singapore
Dr. Dingyuan Tang, Nanyang Technology University, Singapore
Dr. Antonio Teixeira, Universidade de aveiro Instituto de telecomunicacoes, Portugal
Dr. Jing Xu, Zhejiang University, China
Prof. Zinan Wang, Univ. of Electronic Science & Tech China, China
Prof. Rui Q. Yang, University of Oklahoma, USA
Prof. Chao Zhao, Institute of Semiconductors, Chinese Academy of Sciences, China
Prof. Linjie Zhou, Shanghai Jiao Tong University, China
Prof. Renjie Zhou, The Chinese University of Hong Kong, Hong Kong
About this Journal
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