Editorial Board
Senior Editors
Prof. Hoon Kim, Korea Advanced Institute of Science and Technology, Korea
Dr. Andrew W. Poon, The Hong Kong University of Science and Technology, Hong Kong
Associate Editors
Prof. Jose Azana, Institut National de la Recherche Scientifique, Canada
Dr. Gilberto Brambilla, University of Southampton, United Kingdom
Dr. Jian Chen, Nanjing University of Posts and Telecommunications, China
Dr. Hao Chi, Hangzhou Dianzi University, China
Prof. Brian Culshaw, University of Strathclyde, United Kingdom
Prof. Daoxin Dai, Zhejiang University, China
Dr. Ivana Gasulla, Universidad Politecnica de Valencia, Spain
Dr. Amirhossein Ghazisaeidi, Nokia Bell Labs, France
Dr. Madeleine Glick, Columbia University, USA
Prof. Miguel González-Herráez, University of Alcalá, Spain
Dr. Ezra Ip, NEC Labs America, USA
Prof. Ching-Ting Lee, National Cheng Kung University, Taiwan
Dr. Kwanil Lee, Korea Institute of Science and Technology, Korea
Dr. Christina Lim, The University of Melbourne, Australia
Dr. Xianshu Luo, Advanced Micro Foundry Pte. Ltd, Singapore
Dr. Jason D. McKinney, Naval Research Laboratory, USA
Prof. Tadao Nagatsuma, Osaka University, Japan
Dr. Salah S A Obayya, Zewail City of Science and Technology, Egypt
Prof. Kyunghwan Oh, Yonsei University, South Korea
Dr. Pierluigi Poggiolini, Politecnico di Torino, Italy
Prof. Malin Premaratne, Monash University, Australia
Dr. Koichi Takiguchi, Ritsumeikan University, Japan
Dr. Dingyuan Tang, Nanyang Technology University, Singapore
Dr. Antonio Teixeira, Universidade de aveiro Instituto de telecomunicacoes, Portugal
Dr. Dirk van den Borne, Juniper Networks, Germanay
Dr. Chao Wang, University of Kent, United Kingdom
Prof. Zinan Wang, Univ. of Electronic Science & Tech China, China
Dr. Markus Weyers, Ferdinand-Braun-Institut fuer, Germany
Dr. Jonathan Wierer, Lehigh University, USA
Dr. Gregory Wurtz, King's College London, United Kingdom
Prof. Rui Q. Yang, University of Oklahoma, USA
Prof. Linjie Zhou, Shanghai Jiao Tong University, China
About this Journal
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Time to Publication: 70 days